Tag Archives: IC

Real-time x-ray 3D inspection of bga ic and pcb – part 1

BGA X-ray optical inspection was designed for the non-destruction 3d visual ral-time inspection of hidden solder joints on pcb. source Zero Defects International Brings in Taiyo PCB Inspection System Zero Defects International [ZDI] has been assigned by Taiyo Industrial Company, Japan, to manage the North American introduction of it’s automatic printed circuit board final inspection […]

Mouser adds SPICE simulation to MultiSIM PC Board software tool

Mouser adds SPICE simulation to MultiSIM PC Board software tool The most recent MultiSIM BLUE version of the NI Multisim circuit board design software tool that is offered by Mouser Electronics is the Advanced version includes a Berkley SPICE simulation environment. Concerning SPICE SPICE (Simulation Program with Integrated Circuit Emphasis) is a general-purpose, free analogue […]