Tag Archives: BGA

Real-time x-ray 3D inspection of bga ic and pcb – part 1

BGA X-ray optical inspection was designed for the non-destruction 3d visual ral-time inspection of hidden solder joints on pcb. source Zero Defects International Brings in Taiyo PCB Inspection System Zero Defects International [ZDI] has been assigned by Taiyo Industrial Company, Japan, to manage the North American introduction of it’s automatic printed circuit board final inspection […]

PCB Inspection

No scratches or residues. All contact points are intact. source Zero Defects International Introduces Taiyo PCB Inspection System Zero Defects International [ZDI] has been designated by Taiyo Industrial Company, Japan, to manage the North American introduction of it’s programmed printed circuit board final inspection systems. These inspection systems have gained widespread success in Europe and […]