Tag Archives: 3D

Real-time x-ray 3D inspection of bga ic and pcb – part 1

BGA X-ray optical inspection was designed for the non-destruction 3d visual ral-time inspection of hidden solder joints on pcb. source Zero Defects International Brings in Taiyo PCB Inspection System Zero Defects International [ZDI] has been assigned by Taiyo Industrial Company, Japan, to manage the North American introduction of it’s automatic printed circuit board final inspection […]